Results .

 

Intellectual Outputs

Contents

1. MICROBONDS AND MICROBONDING PROCESSES 8

1.1 Basics of microbonding 9

1.1.1 Main processes 9

1.1.2 Applications 11

1.1.3 Materials 12

1.2 Microbonds 16

1.2.1 Types of microbonds 16

1.2.2 Characteristics of microbonds 16

1.2.3 Functionalities of microbonds 17

1.3 Advantages and disadvantages 18

1.3.1 Advantages 18

1.3.2 Disadvantages 19

1.4 General requirements for the process implementation 19

1.4.1 Health and safety 19

1.4.2 Electrostatic discharge (ESD) 21

1.4.3 Conditions for the laboratory 24

1.5 Economical aspects 25

Annex 31

Specific standards 31

Chapter 1 Questions for self-evaluation 34

Chapter 1 - References 36

2. EUTECTIC MICROBONDING 39

2.1 Basics of Eutectic Microbonding 40

2.2 Base materials and preparation of joints 49

2.3 Solders and fluxes 56

2.4 Equipment structure 65

2.5 Solder Processes 73

2.6 Quality of microbonds 78

2.7 Health and safety consideration in Eutectic Microbonding 87

Chapter 2 - Questions for self-evaluation 94

Chapter 2 - References 96

3. THERMOSONIC MICROBONDING 97

3.1 Basics of Thermosonic Microbonding 98

3.1.1 Principle of the process 98

3.1.2 Microbonds 100

3.1.3 Versions of the process 103

3.2 Base materials and preparation of joints 104

3.2.1 Base materials 104

3.2.2 Parallelism and co-planarity 104

3.3 Equipment structure 104

3.3.1 Generals 104

3.3.2 Capillary tool for ball bonding and wedge nozzle for wedge bonding 106

3.3.3 Capillary tool and wedge nozzle cleaning 109

 

4.4 Durability of Adhesives for Adhesive Microbonding 161

4.4.1 Introduction to the durability of adhesive joints 161

4.4.2 Dinamic loads 161

4.4.3 Creep and viscoelastic phenomena 162

4.4.4 Humidity 162

4.4.5 Extreme temperatures 162

4.4.6 Chemical agents 163

4.4.7 Combined effects of temperature, humidity and mechanical stress 163

Chapter 4 - Examination 164

Chapter 4 - References 166

5. QUALITY MANAGEMENT IN MICROBONDING PROCESSES 167

5.1 Material certification 169

5.2 Storage Conditions for Materials 169

5.2.1 Storage Solder Paste Conditions 170

5.2.2 Environmental Conditions 170

5.2.3 Product Storage 171

5.3 Basics of Visual Inspection 171

5.3.1 Visual Inspection of Bond Quality 171

5.3.1.1 Pre Bonding Inspection 172

5.3.1.2 Post Bonding Inspection 173

5.4 Basics of Quality Tools and Techniques 175

5.4.1 Wire Bond Pull Test 175

5.4.2 Ball Shear Test 179

5.4.3 Non-Destructive Bond Pull Test 181

5.4.4 Wafer Bond Testing 183

5.5 Failure Modes/Mechanism of the Bonds 188

5.5.1 Ball Bonds 188

5.5.2 Wedge Bonds 189

5.5.3 Wafer Bonds 192

5.6 Introduction to Quality Assurance Standards in Microbonding Processes 193

5.7 Structure of Microbond Procedure Specification (MBPS) 195

5.7.1 Adhesive/Eutectic Wafer Bonding 195

5.7.2 Wire Ball/Wedge Bonding 196

Chapter 5 - Examination 200

Chapter 5 - References 202

 

Structure of the training courses according to the developed Guidelines

EUROPEAN MICROBONDING PERSONNEL

The developed Guideline presents the minimum requirements for education, training and examination, in terms of Learning outcomes, Actions, Performance Criteria, Knowledge, Competences and Skills, and the workload required in each module.

 

The guideline is structured in 6 chapters. These chapters include the minimum requirements for education and training, the course overview, tasks and responsibilities of the trainees after performing the course, the competence units and the learning outcomes. The last chapter includes the rules for examination and qualification

 

Guidelines:

 

MINIMUM REQUIREMENTS FOR THE EDUCATION, TRAINING, EXAMINATION AND QUALIFICATION OF PERSONNEL

COURSE SUPPORT EDIT AS BOOK

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3.4 Technology 110

3.4.1 Bonding mechanism and metallurgy 110

3.4.2 Technological aspects 111

3.4.2 Process parameters and their influences 120

3.5 Applications 124

3.5.1 Wire bonding applications 124

3.5.2 Thermosonic flip-chip bonding 124

3.6 Quality of microbonds 125

3.6.1 Aspects regarding the reliability of the thermosonic microbonds 125

3.6.3 Specific faults / material imperfections / defects 129

3.6.4 Contamination of the bond 135

3.7 Health and safety consideration in Thermosonic Microbonding 136

3.7.1 Risks in handling components of the thermosonic microbonding equipment 136

3.7.2 Risks in running the thermosonic microbonding process 138

Chapter 3 - Questions for self-evaluation 141

Chapter 3 - References 143

4. ADHESIVE MICROBONDING 144

4.1 Fundamentals of Adhesion and Adhesives 145

4.1.1 Definition of terms 145

4.1.2 Different steps, including its description, during the adhesive microbonding procces. 145

4.1.3 Characteristics of the adhesive joints 147

4.1.4 Type of failures of adhesive microbondings. 148

4.2 Surface Preparation Before Adhesive Microbonding 149

4.2.1 Introduction 149

4.2.2 Objectives of surface preparation. 149

4.2.3 Main surface pretreatments 150

4.2.4 Surface treatments of plastic materials: 150

4.2.5 Surface treatments of plastic materials: 151

4.2.6 Surface treatments of ceramic materials 152

4.2.7 Surface treatments of metallic materials 152

4.3 The Main Families of Adhesives for Microadhesive Bonding 153

4.3.1 Introduction 153

4.3.2 Polychloroprene adhesives 153

4.3.3 Acrylic adhesives 154

4.3.4 Cyanoacrylates 156

4.3.5 Epoxy adhesives 158

4.3.6 Polysulphides 159

4.3.7 Pressure sensitive adhesives 159

4.3.8 Hotmelts 160

 

 

Text Box:  MICROBOND, 2016

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please send request to:

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O1 Report on the Identification of the requirements for training + qualification

Elaboration of a questionnaire

It were elaborated 2 questionnaires, instead 1, after analysis of the received answers during the survey when used the first questionnaire. It was considered that a second questionnaire is necessary. The second questionnaire was elaborated by the consortium and it was involved in the survey, which was prolonged with 1 month.

 

Perform specific survey among the different consortium countries and beyond

The period of the survey was prolonged with 1 month due to the launching on the labour market of the second questionnaire

 

Report as a result of the study

The results received for the both questionnaires were considered within the report.

 

Rating:

Solved: > 100%

O2 Draft Guideline for training + qualification

Draft guideline for the training + qualification of personnel - the document will be as draft until the technical commissions of EWF will apply the procedure of approval.

(by experience, the procedure will have a duration of 3-5 years, due to the analysis of the best way of harmonization; this is the reason of considering in the proposal the term of Draft Guideline)

Content:

Curricula

Number of hours

Aims

Conditions to access to the qualification process

Conditions of evaluation of the trainee + certificate + validity + extension of time

 

Document that regulates the methodology of training-qualification-certification of the bonding personnel

Rating:

O3 Teaching + learning materials: course support + presentations

Course support book + presentations EN

Course support book + presentations PT

Course support book + presentations RO

Course support book + presentations ES

Course support book + presentations IT

Printed Book in EN

As extra result, ASR will publish the book in RO language, as well

 

Rating:

Solved: > 100%

O4 Teaching + learning materials: teaching software + videos + images

Teaching software: on DVD in EN

Videos, images: in digital form on DVD

Rating:

O5 Evaluation Tool

Software for self-evaluation

Software for evaluation of the trainees qualification digital questionnaire

100 questions and answers translated in national languages (PT, RO, ES, IT)

Software Interface - EN

Software tool on DVD in EN

Rating:

Modules

Teaching hours

(Theoretical T and Practical P)

EEM

ETM

EAM

T

P

T

P

T

P

Module 1 - Microbonds and microbonding processes

5

-

5

-

5

-

Module 2 - Eutectic microbonding

8

12

-

-

-

-

Module 3 - Thermosonic microbonding

-

-

8

12

-

-

Module 4 - Adhesive microbonding

-

-

-

-

8

12

Module 5 - Quality management in microbonding processes

5

 

5

 

5

 

TOTAL

30

30

30

European Eutectic Microbonder

EEM

European Thermosonic Microbonder

ETM

European Adhesive Microbonder

EAM